产品与市场
SDI06K
特点
● 无铅兼容● 高Tg无卤，Tg 220℃ (TMA)
● 较低的X/Y/Z轴CTE
● 低介质常数及损耗
应用领域
● 适用于智能手机，笔记本电脑，平板电脑，仪表盘，录像机，电视，电子游戏机，通讯设备及汽车电子等- 产品性能
- 产品证书
- 资料下载
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Tg | 2.4.24.4 | DMA | ℃ | 260 |
| 2.4.24 | TMA | 220 | ||
| Td | 2.4.24.6 | 5% wt. loss | ℃ | 420 |
|
T288 |
2.4.24.1 | TMA | min |
＞60 |
| T260 |
2.4.24.1 |
TMA |
min |
＞60 |
|
Thermal Stress |
2.4.13.1 |
288℃, solder dip |
- | PASS |
| CTE (Z-axis) | 2.4.24 | Before Tg | ppm/℃ | 25-30 |
| 50-260℃ | % | 1.4 | ||
| Dissipation Constant (1GHz) | 2.5.5.9 | C-24/23/50, RC50% | - | 4.0 |
|
Dissipation Factor (1GHz) |
2.5.5.9 |
C-24/23/50, RC50% |
- | 0.0040 |
| Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ.cm | 4.76×108 |
|
Surface Resistivity |
2.5.17.1 |
C-96/35/90 | MΩ | 1.84×107 |
| Arc Resistance | 2.5.1 | D-48/50+D-0.5/23 | s | 181 |
| Dielectric Breakdown | 2.5.6 | D-48/50+D-0.5/23 | kV | ＞45 |
|
Peel Strength (H Oz) |
2.4.8 |
A |
N/mm |
0.95 |
|
Flexural Strength (LW/CW) |
2.4.4 |
A |
GPa |
24/ 23 |
| Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.15 |
|
Flammability |
UL94 |
C-48/23/50 |
Rating |
V-0 |
Remarks:
Remarks: 1. All the typical value is based on the1.0mm specimen. (*) is based on 0.10mm(1x2116) specimen.
2. All the typical value listed aboveis for your reference only, please turn to Shengyi Technology Co., Ltd fordetailed information, and all rights from this data sheet are reserved byShengyi Technology Co., Ltd.